发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component by which the position of an internal electrode of a green sheet laminate can be recognized more accurately, and both material waste and cost can be reduced. SOLUTION: The method of manufacturing the electronic component includes a lamination step of stacking a first green sheet wherein an internal electrode layer comprised of a plurality of internal electrodes is formed on its surface, as well as a second green sheet wherein a margin pattern layer thicker than the internal electrode layer is formed on its surface in a manner to bury a gap of the internal electrode layer; a crimping step of crimping the laminated first and second green sheets and form a green sheet laminated body; a detection step of detecting a projection part produced on the green sheet laminate due to the margin pattern layer; a step of determining the cutting position according to the detected projection part; and a cutting step of cutting the green sheet laminated body along the cutting position. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008153276(A) 申请公布日期 2008.07.03
申请号 JP20060336951 申请日期 2006.12.14
申请人 TDK CORP 发明人 ABE TATSU;ITO MASATOSHI;TATSUMI SUMIYUKI;YODOGAWA YOSHIMI;SHINDO HIROSHI;YAGI HIROSHI
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
代理机构 代理人
主权项
地址