发明名称 REACTIVE MULTILAYER JOINING WITH IMPROVED METALLIZATION TECHNIQUES
摘要 A process and apparatus for the reactive multilayer joining of components utilizing metallization techniques to bond difficult-to-wet materials and temperature sensitive materials to produce joined products.
申请公布号 WO2008079461(A2) 申请公布日期 2008.07.03
申请号 WO2007US77723 申请日期 2007.09.06
申请人 REACTIVE NANOTECHNOLOGIES, INC.;DUCKHAM, ALAN;WEIHS, TIMOTHY, P.;NEWSON, JESSE;LEVIN, JONATHAN;VALLIAPPAN, SOMASUNDARAM 发明人 DUCKHAM, ALAN;WEIHS, TIMOTHY, P.;NEWSON, JESSE;LEVIN, JONATHAN;VALLIAPPAN, SOMASUNDARAM
分类号 B23K1/20;B23K31/02;B32B15/00;C23C14/00 主分类号 B23K1/20
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