| 摘要 |
A flip chip mounting bump, a manufacturing method thereof, a flip chip bonding method using a non-conductive adhesive are provided to enhance a plastic deformation effect in a low pressure range and to improve the endurance by forming a bump like a sphere type structure or a mushroom type structure. A flip chip mounting bump structure includes a chip, a plurality of lower metal patterns, and a bump. The plurality of lower metal patterns are formed on the chip. The bump is formed on the lower metal pattern. The bump is formed like a sphere type structure or a mushroom type structure. The bump is made of one selected from a group consisting of Au, Cu, Sn, Ni, Bi, In, Ag, Zn and the alloy thereof. |
