| 摘要 |
A light emitting diode package and a method for fabricating the same are provided to prevent reduction of performance and lifespan caused by the thermal effect of an LED chip by forming the lead frame as the sufficient thickness to radiate the heat. A groove(122) of a cup shape is formed on a lead frame(10). A main body of a package is formed to support the lead frame. An LED chip(40) is mounted into the groove of the lead frame as the uniform height. The groove is formed by a press process. Wherein, the thickness of the lead frame is 0.3 to 0.6 mm.
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