HIGH DENSITY LITHOGRAPHIC PROCESS

摘要

A method is provided for patterning monolithically integrated features having a 1:1 ratio. The method comprises forming a first etch barrier layer (18) over a base layer (14) and applying (52) a template (20) to pattern (52) first printed features (26) in the first etch barrier layer (18). The first etch barrier layer (18) is etched (54) to form second printed features (32) in the base layer (14). A second etch barrier layer (34) is formed over the base layer (14) and the template (20) is applied to pattern (58) third printed features (38) in the second etch barrier layer (34). The second etch barrier layer (34) is etched (60) to form fourth printed features (42) in the base layer (14).