| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a re-peelable and re-attachable noncontact IC tag label for easily peeling a non-contact IC tag label attached to an object, and for attaining cost reduction or resource saving, by making it possible to adhere the noncontact IC tag label to another object again. <P>SOLUTION: This noncontact IC tag label is configured, by adhering a base film equipped with a non-contract IC tag circuit via an adhesive layer at the lower-face side of the surface substrate sheet having a predetermined size, and an absorption layer is formed on either the upper or the lower side of the base film so as to be attachable to the object, by creating vacuum or a state close to vacuum, between the non-contact IC tag label and the object in the case of attaching the noncontact IC tag label to the object. <P>COPYRIGHT: (C)2008,JPO&INPIT |
