| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multichip package structure, where a substrate having a die holding cavity formed within the range of an upper surface and a first through-hole structure is included, and a terminal pad is formed at the lower portion of the first through-hole structure. <P>SOLUTION: The multichip package structure includes the substrate having the die holding cavity formed within the range of the upper surface and the first through-hole structure, where the terminal pad is formed at the lower portion of the first through-hole structure. A first die is arranged in the die holding cavity, and a first dielectric layer is formed on the first die and the substrate. A first redistribution conductive layer (RDL) is formed on the first dielectric layer. A second dielectric layer is formed on the first RDL and a second die is mounted on a second dielectric layer. A surrounding material surrounds the second die. A second redistribution conductive layer (RDL) is formed on a third dielectric layer. A protective layer is formed on the second RDL. <P>COPYRIGHT: (C)2008,JPO&INPIT |
