| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure and a semiconductor device capable of preventing deformation of a circuit board caused by heating during packaging, and improving reliability of electrical conductivity between the circuit board and a mother board. SOLUTION: A semiconductor device 30 formed on the circuit board 20 is sealed with a first seal layer 40, a second resin layer 41 is formed on the first seal layer 40, and thermal expansion coefficient of the circuit board 20 and the second seal layer 41 in an in-plane direction is lower than that of the first seal layer 40 at a glass transition point or higher. Therefore the warpage of the circuit board 20 generated when the semiconductor device 10 is mounted on the mother board, is suppressed by thermal expansion coefficient of the second seal layer 41 in an in-plane direction. As a result, it is possible to achieve the mounting structure having high reliability of electrical conductivity between the circuit board 20 and the mother board. COPYRIGHT: (C)2008,JPO&INPIT |
