| 摘要 |
Provided are a semiconductor package and a manufacturing method thereof. A semiconductor package according to an embodiment comprises a chip part on a board, a mold member, and a plated layer on the mold member. The plated layer comprises an electrode pattern connected to a pattern of the board. The electrode pattern of the palted layer can be mounted at least one of at least one a chip part and at least one another semiconductor package. |
