CAPACITOR LAYER FORMING MEMBER FOR MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING CAPACITOR LAYER FORMING MEMBER

摘要

A capacitor layer forming member having a lower electrode circuit fabricating conductive layer containing cupper as a main component and exhibiting a good and stable dielectric characteristic. The capacitor layer forming member comprises an upper electrode circuit fabricating conductive layer, a lower electrode circuit fabricating conductive layer, and a dielectric layer interposed between the conductive layers. The capacitor layer forming layer for forming a built-in capacitor layer of a multilayer printed wiring board is characterized in that the lower electrode circuit fabricating conductive layer is a cupper electrode and a zinc-containing layer in contact with the dielectric layer is provided. As a method for manufacturing a capacitor layer forming member, a method in which a zinc layer is provided to the upper electrode circuit fabricating conductive layer and subjected to heat treatment in an oxidizing atmosphere, the zinc component is transformed to zinc oxide to form the lower electrode circuit fabricating conductive layer, a dielectric layer is formed on the zinc-containing layer, and the upper electrode circuit fabricating conductive layer is formed on the dialectic layer thereby to fabricate a capacitor layer forming member or the like are adopted.