FABRICATING METHOD OF MULTI LAYER PRINTED CIRCUIT BOARD

摘要

A method for fabricating a multi layer printed circuit board is provided to reduce a manufacturing cost and time of the multi layer printed circuit board by stacking a prepreg and a polyimide CCL on both sides of an aluminum core layer with a batch stacking method. A method for fabricating a multi-layer printed circuit board includes the steps of: forming a window to expose a polyimide layer by removing a copper layer(104a) of a portion where a via hole is formed after a polyimide CCL layer is prepared; forming the via hole to expose the copper layer below the polyimide layer through the window; forming a circuit pattern after forming a copper plating layer on an inside wall of the via hole and the copper layer; forming a bump on the circuit pattern; and heating and pressing with a press by sequentially aligning the polyimide CCL, a prepreg(114), an aluminum core layer(116), the prepreg, and the polyimide CCL.