发明名称 HEAD ASSEMBLY FOR CHIP MOUNTER
摘要 A head assembly for a chip mounter is provided to stably support a spindle with a gripper during lifting of the spindle, thereby improving the reliability of the head assembly. A platform(110) has a rotation axis(111) rotated by a motor(120) and a plurality of through holes(113) around the rotation axis. A plurality of spindles(130) are inserted into the through holes of the platform to be vertically lifted and have nozzles(135) at lower ends to absorb chips and spindle pressing units at outer sides. A spindle support unit has an upper support unit extended in a circumferential direction to support an upper surface of the spindle pressing unit, a lower support unit extended in a circumferential direction within a predetermined range to support a lower surface of the spindle pressing unit, and a groove unit formed on a lower surface of the upper support unit. An upper selecting unit has an upper gripper protruded outward to be inserted into the groove unit of the spindle support unit, is coupled with the rotation axis to rotate with the rotation axis, and presses the upper surface of the spindle pressing unit downward to lift down the spindle. A lower selecting unit is installed outside the upper selecting unit to vertically move along the upper selecting unit, supports the lower surface of the spindle pressing unit, and has a magnetic body at a lower end. An electromagnet is installed outside the upper selecting unit to face the magnetic body and generates magnetic force against the magnetic body according to an external signal. A lift driving unit(160) is connected to the upper selecting unit and generates vertical driving force to lift up and down the upper selecting unit.
申请公布号 KR20080061787(A) 申请公布日期 2008.07.03
申请号 KR20060136880 申请日期 2006.12.28
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 HAN, YOON SEOK
分类号 H05K13/04 主分类号 H05K13/04
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