| 摘要 |
Film packages comprising at least two stress-adjusting leads on one selected stress-adjusting bump are provided to minimize influence of stress generated in the film packages by using stress control leads corresponded with a stress control bump and a bump thereof. A semiconductor device(70) is disposed on a base film, and connected with the base film electrically through a selected plane. A stress control bump(53,59) is disposed between the semiconductor device and the base film, and limited on the selected plane of the semiconductor device. At least two stress control leads(31,33,37,39) are disposed on the base film so as to be positioned between the stress control bump and the base film.
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