| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: leads are not mounted due to a difference in an exposure area of each of the leads because a mounting area is small on only the lead exposure portion and the island is exposed to improve the mounting area, in a conventional semiconductor device, especially in a QFN type package. SOLUTION: In the semiconductor device, part of the leads 23 and part of each of islands 28 are exposed from a backside 26 of a resin package 22. That means, a part of each of the islands is exposed from the backside of the resin package 22 and this is employed as a recognition mark. Concretely, the island 28 is removed from the backside, a coating resin is provided on the removed part. As a result, part of the island is exposed and a part having a processed shape is employed as the recognition mark. COPYRIGHT: (C)2008,JPO&INPIT |
