| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a MEMS device for reducing an amount of side etching in a part where etching is essentially undesirable when releasing a movable electrode to miniaturize this device. SOLUTION: A first inter-layer insulation membrane 15 and a first wiring layer 25 are formed by laminating them in this order after forming the movable electrode 50, and a part of the first inter-layer insulation membrane 15 is left to cover the whole surface of the movable electrode 50 in order to form a preliminary opening part C1a. Next, a lower layer 11 of a second inter-layer insulation membrane is formed, an SOG membrane 14 is laminated and etched back to let the SOG membrane remain in the preliminary opening part C1a. Then, an upper layer 12 of the second inter-layer insulation membrane is laminated to complete the second inter-layer insulation membrane 16, and then a second wiring layer 26 is formed to complete a wiring laminated part 30 and form a protective membrane 20 on it. Each of a part of the protective membrane 20, the wiring laminated part 30 including the SOG membrane remaining in the preliminary opening part C1a, and a sacrifice layer 5 is removed to release the movable electrode 50. COPYRIGHT: (C)2008,JPO&INPIT
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