发明名称 Method of forming phase change layer, method of manufacturing a storage node using the same, and method of manufacturing phase change memory device using the same
摘要 Provided are a method of forming a phase change layer, a method of manufacturing a storage node using the method of forming a phase change layer, and a method of manufacturing a phase change memory device using the method of manufacturing a storage node. The method of forming a phase change layer may use an electrochemical deposition (ECD) method. The method of forming the phase change layer may include forming an electrolyte by mixing a solvent and precursors, each precursor containing an element of the phase change layer, dipping an anode plate and a cathode plate in the electrolyte to be spaced apart from each other, wherein the cathode plate may be a substrate on which the phase change layer is to be deposited, setting deposition conditions of the phase change layer; and supplying a voltage between the anode plate and the cathode plate.
申请公布号 US2008156651(A1) 申请公布日期 2008.07.03
申请号 US20070000378 申请日期 2007.12.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG YOUN-SEON;BACK KAE-DONG;SHIN WOONG-CHUL;OH SEUNG-JIN
分类号 B05D1/36;C25D5/54 主分类号 B05D1/36
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