发明名称 |
Method of forming phase change layer, method of manufacturing a storage node using the same, and method of manufacturing phase change memory device using the same |
摘要 |
Provided are a method of forming a phase change layer, a method of manufacturing a storage node using the method of forming a phase change layer, and a method of manufacturing a phase change memory device using the method of manufacturing a storage node. The method of forming a phase change layer may use an electrochemical deposition (ECD) method. The method of forming the phase change layer may include forming an electrolyte by mixing a solvent and precursors, each precursor containing an element of the phase change layer, dipping an anode plate and a cathode plate in the electrolyte to be spaced apart from each other, wherein the cathode plate may be a substrate on which the phase change layer is to be deposited, setting deposition conditions of the phase change layer; and supplying a voltage between the anode plate and the cathode plate.
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申请公布号 |
US2008156651(A1) |
申请公布日期 |
2008.07.03 |
申请号 |
US20070000378 |
申请日期 |
2007.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG YOUN-SEON;BACK KAE-DONG;SHIN WOONG-CHUL;OH SEUNG-JIN |
分类号 |
B05D1/36;C25D5/54 |
主分类号 |
B05D1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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