METHOD FOR MOUNTING SEMICONDUCTOR COMPONENT ON CIRCUIT BOARD

摘要

[PROBLEMS] To apply a uniform quantity of solder onto a stud bump of a semiconductor component and bond the stud bump on a boding pad on a circuit board with a solder. [MEANS FOR SOLVING PROBLEMS] Provided is a method which includes a step of preparing a semiconductor component (10) whereupon a plurality of stud bumps (12) are arranged; a step of preparing a solder substrate (13) whereupon a solid solder (14) is arranged to correspond to each of the stud bumps; a step of preparing a circuit board (20) having a bonding pad (21) to correspond to each of the stud bumps; a step of adhering the corresponding solid solder on the solder substrate, on each of the leading end portions of the stud bumps; a step of removing the solid solder adhered on the leading end portions of the stud bumps from the solder substrate; a step of bringing the solid solder adhered on the each leading end portion of the stud bump and the corresponding bonding pad into contact with each other; and a step of bonding each of the stud bumps and the corresponding bonding pad with the solder, by melting the solid solder brought into contact with the corresponding bonding pad.