WIDE BAND AND RADIO FREQUENCY WAVEGUIDE AND HYBRID INTEGRATION IN A SILICON PACKAGE

摘要

A device includes a device wafer (400) having a circuit component (375) formed thereon and having vias (300) formed therein and a cap wafer (100) bonded to the device wafer. The cap wafer has a cavity (250) therein. The cavity has a post (200) formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor (350) within the cavity.