发明名称 PROCESS FOR PRODUCTION OF DEVICES
摘要 <p>[PROBLEMS] The invention relates to a process for the production of devices which comprises the step of forming a wiring circuit by etching an aluminum alloy film and proposes a production technique for protecting the aluminum alloy film from damage as completely as possible to realize highly reliable devices. [MEANS FOR SOLVING PROBLEMS] A process for the production of devices which comprises the step of forming an aluminum alloy film on a substrate and etching the aluminum alloy film to form a wiring circuit, wherein the surface of the aluminum alloy film is oxidized after the formation of the film. This surface oxidation is conducted in such a way that the resulting surface-oxidized aluminum alloy film secures at least 80% of the thicknesswise etching speed as calculated in etching an aluminum alloy film of a prescribed thickness with a naturally oxidized layer by use of an etchant for aluminum alloy over the whole thickness.</p>
申请公布号 KR20080063339(A) 申请公布日期 2008.07.03
申请号 KR20087009478 申请日期 2008.04.21
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 KUBOTA TAKASHI;MATSUURA YOSHINORI
分类号 H01L29/786;C22C21/00;G02F1/1343 主分类号 H01L29/786
代理机构 代理人
主权项
地址
您可能感兴趣的专利