A MICRO-FLUID EJECTION HEAD CONTAINING REENTRANT FLUID FEED SLOTS
摘要
Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.
申请公布号
WO2006060554(A3)
申请公布日期
2008.07.03
申请号
WO2005US43442
申请日期
2005.12.01
申请人
LEXMARK INTERNATIONAL, INC.
发明人
KRAWCZYK, JOHN, W.;MCNEES, ANDREW, L.;WARNER, RICHARD, L.