| 摘要 |
A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the removable adhesive layer. Use of an interposer layer and a removable adhesive layer in combination with a non-removable adhesive layer, provides a high performance heat dissipation assembly while enabling re-working of the assembly following initial manufacture. |
