| 摘要 |
<p>A semiconductor LED package is provided to facilitate heat radiation and a circuit configuration of an LED device by improving an electrode structure including a wiring pattern. A semiconductor LED package comprises a main body(160) of a heat conductive package in which a groove is formed at the upper portion, an electrode(132) which is formed in the groove, at least one LED(140) which is connected with the electrode and formed in the groove, and a wiring pattern(130) which is formed at outer side of the main body of the package and is connected with the electrode.</p> |
