| 摘要 |
<p>A laser dicing device and method for carrying out high-speed dicing with high quality without causing defective machining even if a wafer having a different thickness is fed. The laser dicing device comprises measuring means for measuring the thickness of a wafer (W), recording means storing a database where a modification region forming condition corresponding to the thickness of the wafer (W) is described, and control means for controlling the laser dicing device by automatically selecting the modification region forming condition matching the measured thickness of the wafer (W) from the database according to the thickness of the wafer measured by the measuring means. Since the most suitable modification region forming condition is automatically determined, no defective machining occurs even if a wafer (W) having a different thickness is fed, and quick dicing with high quality can be carried out.</p> |
