METHOD FOR EXPOSURE PROTECTING DEFOCUS OF EDGE IN WAFER

摘要

An exposure method is provided to prevent defocus of an abnormal region of a wafer edge by forming a focusing region at the inner side of the wafer edge as below 3mm. As a method for preventing defocus of wafer edge, a region for focusing is formed at the inner side of the wafer edge as below 3mm, so that an abnormal region of the wafer edge can not be focused. When performing edge shot focusing and leveling, a system parameter does not apply shift focus and performs normal leveling using previous normal shot focus data.