| 摘要 |
A semiconductor device is provided to shorten a developing period of products by testing the semiconductor device being mounted on a board. A semiconductor device includes a pin(101), a signal generation unit(104), a decoding unit(105), and a pad(103). An external mounting test signal is applied to the pin. The signal generation unit generates a plurality of internal test mode signals in response to the voltage level of the mounting test signal. The decoding unit decodes the internal test mode signal. The pad connects the pin to the signal generation unit. The signal generation unit has a plurality of comparators for comparing the mounting test signal with a plurality of reference voltages. |
