| 摘要 |
A semiconductor chip is provided to decrease the size thereof by decreasing a distance between inner leads by making the inner leads different in height. A semiconductor chip comprises a plurality of pads(203A,203B) which have different heights, bumps(206A,206B) which are formed on the pad, and inner leads(207A,207B) which are connected to the upper part of the bump. The height difference between the pads is obtained by forming auxiliary pads on a part of the pads. |
