| 摘要 |
A semiconductor package is provided to improve a heat radiation performance of the semiconductor package by decreasing a distance between a semiconductor chip and a heat sink. A semiconductor package includes a PCB(Printed Circuit Board)(102), a semiconductor chip(104), a sealing member(108), a heat sink, an adhesive agent, and a solder ball(114). The semiconductor chip is attached to an upper surface of the PCB. The sealing member encloses the semiconductor chip and has a convexo-concave surface. The heat sink is attached to the sealing member and has a convexo-concave shape corresponding to the sealing member. The adhesive agent attaches the sealing member to the heat sink. The solder ball is attached to a lower surface of the substrate. |
