发明名称 Contact device for power semiconductor modules and disc-shaped semiconductor cells
摘要 <p>A contact spring (100) in an insulating sleeve (300) has a pin-type extension (110) on a spring end that makes contact with a control connection. A connection is formed with a connection cable (500) either directly or with a metal molded part (200) to form an external connection on another spring end.</p>
申请公布号 EP1648029(B1) 申请公布日期 2008.07.02
申请号 EP20050017563 申请日期 2005.08.12
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 KRONEDER, CHRISTIAN;TAUSCHER, BJOERN
分类号 H01L23/48;H01L25/07 主分类号 H01L23/48
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