| 摘要 |
<p>A sputtering apparatus with high usage efficiency of a target is provided. A sputtering apparatus 1 of the present invention includes first and second ring magnets 23a, 23b, first and second magnet members 24a, 24b arranged inside a ring of the first and second ring magnets 23a, 23b, wherein in the first and second ring magnets 23a, 23b and the first and second magnet members 24a, 24b, magnetic poles with the same magnetism are faced toward the rear surface of a first and a second targets 21a, 21b. Thus, in the rear surface of the first and second targets 21a, 21b, the magnetic poles with the same polarity are adjacently arranged, and the absolute value of the strength of horizontal magnetic field components formed in the surfaces of the first and second targets 21a, 21b becomes small and the strength distribution becomes narrow, and the strength of vertical magnetic field components becomes uniform; and consequently, a non-erosion portion is not produced in the first and second targets 21a, 21b.</p> |
