| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate hooking between a lift pin and a guide hole when a heater is made to descent, in a wafer lift mechanism of conventional semiconductor manufacturing equipment. SOLUTION: The lift pin 11 is provided with an upper part 33 which is arranged so as to be able to move relatively to a guide device 20 penetrating the guide device 20 which penetrates the heater 12 vertically and always positioned under than the lower surface of the guide device 20, and an intermediate part 32 which is positioned above and below the lower surface of the guide device, being changed by a relative position to the heater. The lift pin 11 is so constituted that the diameter of the intermediate part is made smaller than that of the upper part.</p> |
