发明名称 LAYERED RESIN MOLDING AND MULTILAYERED MOLDED ARTICLE
摘要 <p>The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.</p>
申请公布号 EP1270209(B1) 申请公布日期 2008.07.02
申请号 EP20010904546 申请日期 2001.02.19
申请人 DAIKIN INDUSTRIES, LTD. 发明人 INABA, TAKESHI;KATO, TAKETO;SAGISAKA, SHIGEHITO;ARASE, TAKUYA;SHIMIZU, TETSUO
分类号 B32B27/28;B32B27/08;B32B27/34;F16L11/04 主分类号 B32B27/28
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