发明名称 ELASTIC SURFACE WAVE DEVICE, MODULE DEVICE, OSCILLATION CIRCUIT, AND ELASTIC SURFACE WAVE DEVICE FABRICATION METHOD
摘要 An objective is to provide an SH wave type SAW device which is a surface acoustic wave device using a quartz substrate and which is small in size and has a large Q value and excellent frequency aging characteristics. An SH wave type surface acoustic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate and constituted of Al or an alloy mainly containing Al and that uses a SH wave as an excitation wave. The piezoelectric substrate is a crystal plate in which a cut angle ¸ of a rotary Y cut quartz substrate is set in a range of -64.0° < ¸ < -49.3° and in which a surface acoustic wave propagation direction is set at 90° ± 5° with respect to a crystal axis X. In the SH wave type surface acoustic wave device, an electrode film thickness H/» standardized by a wavelength of the IDT electrode is 0.04 < H/» < 0.12, where » is a wavelength of the surface acoustic wave to be excited, and a main surface of the piezoelectric substrate is etched by a thickness of 0.002 µm or more.
申请公布号 EP1940021(A1) 申请公布日期 2008.07.02
申请号 EP20060810988 申请日期 2006.09.25
申请人 EPSON TOYOCOM CORPORATION 发明人 OWAKI, TAKUYA;MITSUI, YUJI;YOSHIZAWA, YUZURU
分类号 H03H9/02;H01L41/08;H01L41/09;H01L41/18;H01L41/22;H01L41/332;H03H3/08;H03H9/145;H03H9/25;H03H9/64 主分类号 H03H9/02
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