Multi-piece substrate and method of manufacturing the substrate

摘要

A method for manufacturing a multi-piece circuit board (101) according to the present invention is a method for manufacturing a multi-piece circuit board (101) comprising a frame section (102) and a plurality of piece sections (103 to 106) connected to the frame section (102), which method is characterized by, if a plurality of multi-piece sections each including a defective piece section and a good piece section (104 to 106) in a state in which an outermost layer is not formed yet, making a cut line around the defective piece section on one of the multi-piece circuit boards, and removing the piece section; similarly getting out the good piece section (103) of another multi-piece circuit board; inserting the good piece section (103) gotten out of the other multi-piece circuit board into a vacant location (111) from which the defective piece section is removed; and connecting a joint (109) between said frame section (102) and said inserted piece section (103) by adhesive.