| 摘要 |
A wet etching apparatus for a semiconductor device is provided to control a reaction process between a wafer and a chemical material by controlling a rotation speed of a wafer guide. A wet etching apparatus for a semiconductor device includes a wafer guide(311), a container, and a motor(221). A wafer is mounted on the wafer guide. The wafer guide is in the container. The motor has a rotation shaft. The rotation shaft is coupled with one side of the wafer guide, such that the container is rotated. The container is a reaction tub, where the wafer is reacted with predetermined chemicals, or a cleaning tub, where the wafer is cleansed with distilled water.
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