发明名称 |
HEAT SINK USING A SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH HEAT SINK |
摘要 |
A heat sink (10) is disclosed which comprises a substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the solder layer (3) provides a bonding strength of not less than 30 MPa and a shear strain of not less than 0.07. The hear sink may be a sub-mount which comprises a sub-mount substrate (1), an electrode layer (2) formed on the substrate (1) and a solder layer (3) formed on the substrate (1) wherein the electrode layer (2) is formed with a window portion (2A) having the solder layer (3) embedded therein and is connected to an outer peripheral area of the solder layer (3). A sub-mount that has a high strength of bonding between the solder layer (3) and a semiconductor device is provided at a reduced cost. |
申请公布号 |
EP1939929(A1) |
申请公布日期 |
2008.07.02 |
申请号 |
EP20060810273 |
申请日期 |
2006.09.19 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
NAKANO, MASAYUKI;OSHIKA, YOSHIKAZU |
分类号 |
H01L23/488;B23K35/26;B23K35/28;B23K35/30;C22C5/02;H01L21/50;H01L21/52;H01L21/60;H01L23/373;H01L23/49;H01L33/62;H05K1/03;H05K1/11;H05K3/34 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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