发明名称 APPARATUS AND METHOD FOR CUTTING SUBSTRATE
摘要 An apparatus and a method for cutting a substrate are provided to cut a display panel by using liquid and cooling air without applying external impact during a scribing process for manufacturing a flat panel display, thereby preventing the display panel from being damaged by impact when cutting the substrate. A substrate cutting apparatus(100) comprises the followings. A scribing wheel(130) forms cracks on a display panel(200) by rotating at predetermined speed. A first nozzle(114) supplies liquid to the crack. A second nozzle(123) cools the liquid by supplying cooling air to the liquid supplied to the crack. A first storage tank(110) stores the liquid. A second storage tank(120) stores the cooling air. An auto valve(111) controls inflow of the liquid. A pump(112) transmits the liquid within the first storage tank. An auto valve(113) controls transmission of the liquid. An auto valve(121) controls inflow of the cooing air. An auto valve(122) controls transmission of the cooling air stored in the second storage tank. A rotation shaft(131) rotates the scribing wheel. A scribing body(132) makes the scribing wheel rotate by rotating the rotation shaft. The display panel is cut by volume expansion of the cooled material without tapping the display panel by using a break bar after forming the crack on the display panel. It is prevented that the display panel is damaged by the tapping impact when cutting a substrate.
申请公布号 KR20080059861(A) 申请公布日期 2008.07.01
申请号 KR20060133707 申请日期 2006.12.26
申请人 LG DISPLAY CO., LTD. 发明人 MO, GYU JIN
分类号 G02F1/13 主分类号 G02F1/13
代理机构 代理人
主权项
地址