Increased stand-off height integrated circuit assemblies, systems, and methods

摘要

Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections.