| 摘要 |
<p>A PEB(Post Exposure Bake) apparatus for improving CD(Critical Dimension) uniformity is provided to enhance yield and reliability of a semiconductor device by securing CD uniformity of patterns. A wafer(W) is loaded on a hot plate(10) in an oven chamber after an exposure process. A PEB apparatus applies heat to the wafer. The PEB apparatus includes an additional heating unit(16) installed on the upper part of the hot plate in the oven chamber in order to additionally heat a target position on the wafer and an operating control unit controlling the operation of the additional heating unit. The additional heating unit includes a lamp(16a) for irradiating light, a focusing lens(16b) for focusing the light on the wafer, and a focusing lens driver(16c) for varying the direction of the focusing lens.</p> |
