发明名称 Module, method of manufacturing module, and electronic apparatus using module
摘要 A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board. The side plate portion is positioned between the second electronic component and an inner periphery of the opening. This module occupies a small area.
申请公布号 US7394029(B2) 申请公布日期 2008.07.01
申请号 US20060510734 申请日期 2006.08.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KIMURA JUNICHI
分类号 H01L23/495 主分类号 H01L23/495
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