| 摘要 |
A METHOD OF BACKGRINDING WAFERS WHEREIN BACKGRINDING TAPE (34) OR A PAD IS APPLIED TO THE CHUCK (12) AND NOT TO THE WAFERS. THE BACKGRINDING TAPE (34) OR PAD IS LEFT ON THE CHUCK (12) AS EACH WAFER IS SEQUENTIALLY PLACED ON THE TAPE (34) OR PAD, BACKGROUND, AND THEN REMOVED FROM THE PAD. A TOOL FOR APPLYING TAPE TO A CHUCK (12), AS DESCRIBED HEREIN, FACILITATES THIS METHOD.(FIG 1)
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