A SURFACE MOUNT SOLDER METHOD AND APPARATUS FOR DECOUPLING CAPACITANCE AND PROCESS OF MAKING

摘要

A SYSTEM TO PACKAGE HIGH PERFORMANCE MICROELECTRONIC DEVICES, SUCH AS PROCESSORS, RESPONDS TO COMPONENT TRANSIENTS. IN ONE EMBODIMENT, THE SYSTEM INCLUDES A DECOUPLING CAPACITOR [130] THAT IS DISPOSED BETWEEN A VCC ELECTRICAL BUMP AND A VCC ELECTRICAL BUMP. THE DECOUPLING CAPACITOR[130] HAD VCC AND VSS TERMINALS[134]. THE VCC AND VSS TERMINALS[134] SHARE ELECTRICAL PADS WITH THE VCC ELECTRICAL BUMP AND THE VSS ELECTRICAL BUMP. A SIMPLE CURRENT LOOP IS CREATED THAT IMPROVES THE POWER DELIVERY FOR THE SYSTEM.FIG.1