| 摘要 |
<p>A rubber-modified polyamide resin having phenolic hydroxy groups which has, in the molecule, a phenolic-hydroxy-group-containing aromatic polyamide segment having a structure represented by the following formula (A): (A) (wherein m and n each is an average value; and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected between the following formulae (B-1) and (B-2);-(CH2-CH=CH-CH2)X-(B-1)-(CH2-CH=CH-CH2)Y-(CH2-CH(CN)) Z-(B-2) (wherein x, y, and z each is an average value, provided that x is an integer of 5-200, 0.01<=z/(y+z)<=0.13, and y+z is an integer of 10-200). Also provided is a resin composition containing the resin, in particular, an epoxy resin composition. A cured object obtained from the epoxy resin composition is excellent in flexibility, heat resistance, and electrical properties especially under high-temperature high-humidity conditions.</p> |
