METHOD FOR PHOTOCURING OF RESIN COMPOSITIONS

摘要

The invention relates to methods for Light Emitting Diode (LED) curing of a curable resin composition containing a photoinitiating system, wherein the highest wavelength at which absorption maximum of the photoinitiating system occurs (lambda max Pis) is at least 20 nm below, and at most 100 nm below, the wavelength at which the emission maximum of the LED occurs (lambda LED) .The invention also relates to the use of LED curing in structural applications, in particular in applications for the lining or relining of objects, and to objects containing a cured resin composition obtained by LED curing.