WIRE LOOP, SEMICONDUCTOR DEVICE HAVING SAME AND WIRE BONDING METHOD

摘要

Wire loop, semiconductor device having same and wire bonding method A wire loop includes a wire (3) connecting a first bonding point (A) and a second bonding point (Z) therethrough, wherein an additional wire loop (P) is formed after wire bonding at the second bonding point (Z) without cutting the wire (3) and the additional wire loop (P) is bonded to the second bonding point (Z) or to the vicinity thereof while part of the wire (3) is crushed. Fig. 1A