METHOD FOR MANUFACTURING DEVICE ON SEMICONDUCTOR SUBSTRATE, AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE OF WAFER BASE ON SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and the like capable of preventing problems with regard to a contact printing method to form a doped region inexpensively.

SOLUTION: The method for manufacturing a device on the semiconductor substrate 101 includes a step that extrudes a first dopant contained material containing a first dopant type first dopant onto a surface 102 of the substrate 101, thereby forming first extruded structures 120-1 to 120-4 on first surface regions 102-1 to 102-4 of the substrate 101 of the first dopant contained material and a step that heats the substrate 101 to diffuse the first dopant from the surface regions 102-1 to 102-4 to an inside of the substrate 101, thereby forming the first doped regions 101-1 to 101-4 of the substrate 101.

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