| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of cleaning the surface of a semiconductor wafer formed with a circumferentially extending stepped portion without supplying a cleaning liquid to the radial outside of the stepped portion. SOLUTION: This apparatus for cleaning the surface of the semiconductor wafer formed with the circumferentially extending stepped portion comprises a rotating means for circumferentially rotating the semiconductor wafer, a nozzle for supplying the cleaning liquid to a location radially more inside than the stepped portion on the surface of the semiconductor wafer being rotated by the rotating means, and a guide member having a surface facing the surface of the semiconductor wafer being rotated by the rotating means across the stepped portion. COPYRIGHT: (C)2008,JPO&INPIT
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