| 摘要 |
The fabrication structure for light emitting diode component is disclosed. The fabrication structure of the present invention includes a substrate, a plurality of cavities, a plurality of selection units, a first and a second directional predetermined cut. The plurality of cavities are arranged and disposed on the substrate to form an M rowsxN columns matrix array. M and N are respectively a positive integer. Each selection unit corresponds to each cavity. The first directional predetermined cut is disposed between the rows, and the second directional predetermined cut is disposed between the columns. The first directional predetermined cut and the second directional predetermined cut are utilized to divide the substrate according to the plurality of selection units to obtain a X rowsxY columns area from the M rowsxN columns matrix array. The fabrication structure of the present invention has high density and can be flexibly expanded upon demands
|
