| 摘要 |
A filter chip package and a manufacturing method thereof are provided to reduce a thickness thereof and to enhance productivity thereof by providing a sealed space of a cavity at a lower part of a filter chip. A wiring substrate(110) includes electrodes formed in an inside and an outside of a chip mounting region of an upper surface thereof. A ground wall(116) is formed at the outside of the chip mounting region. A filter chip(120) is bonded with the chip mounting region. A resin dam(117) of a looped curve is formed around the filter chip to maintain a sealed space at a lower part of the filter chip. A mold member(130) of a constant height is molded at the wiring substrate and the outside of the filter chip. A plating layer is formed on a surface of the mold member and is electrically connected to the ground wall.
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