| 摘要 |
A wafer spin chuck is provided to process front and rear surfaces of a wafer to improve vibration and balance of the wafer by fixing an edge part of the wafer through a vacuum method. A wafer spin chuck(100) includes a vacuum path(110) and an edge vacuum hole(112). The vacuum path is formed in an inside of a center of the spin chuck. The edge vacuum hole is formed along a circumferential direction in order to be positioned at an edge part of a wafer(W) connected to the vacuum path. A nitrogen gas hole(122) is formed in the outside adjacent to the edge vacuum hole. The nitrogen gas hole includes a nitrogen gas path(120) which is formed in the outside of the vacuum path of the inside of the spin chuck.
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