| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which allows enhancing luminance and thinning the device shape, a method of manufacturing the light-emitting device and a mounting board. <P>SOLUTION: A light-emitting device is provided, which is characterized by: a package having a substantially rectangular light radiation surface in which a recess is formed, a reverse surface opposite to the light radiation surface, a first side surface substantially orthogonal to both of the light radiation surface and the reverse surface and adjoining both of the light radiation surface and the reverse surface on long sides, and a second side surface opposite to the first side surface; and a light-emitting device provided in the interior of the recess; the first side surface having first and second electric power feeding electrode surfaces connected to the light-emitting device, and having a mount surface provided between the first and second electric power feeding electrode surfaces with a step provided between the first electric power feeding electrode surface and the mount surface and also with a step provided between the second electric power feeding electrode surface and the mount surface, the first and second electric power feeding electrode surfaces arranged recessively from the mount surface. <P>COPYRIGHT: (C)2008,JPO&INPIT |
